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| Nokia Texas Instruments agreement to Boost Smart Phone MarketTexas Instruments and Nokia jointly work for the perfect fit between Series 60 Platform and TI's OMAP processors and platform ; Live Demonstrations at 3GSM World CongressNokia and Texas Instruments announced that they have extended their relationship through an agreement on Nokia's Series 60 Platform and Texas Instrument's industry-leading OMAP application processors. As per the agreement, Texas Instruments intends to optimize the execution of the Series 60 platform on TI's OMAP processors and platform. Significant optimization work has already been completed and the resulting prototype will be demonstrated for the first time this week during the 3GSM World Congress in Cannes, France. The demonstration features TI's Innovator(TM) Development Kit for the Series 60 Platform, which includes a color screen, a keypad and all other components required by Series 60 based smart phones. "Time-to-market is a critical component for any successful handset program," said Niklas Savander, senior vice president, Nokia Mobile Software. "The close collaboration with leading semiconductor companies, such as Texas Instruments, will enable Series 60 Platform licensees to bring phones to market faster. Moreover by tapping into the capabilities of TI's OMAP(TM) platform, the end result will be smart phones with higher performance and advanced functionalities. "Combining technologies from mobile industry leaders, Nokia and TI, will speed the introduction of 2.5G and 3G Smart Phones," said Alain Mutricy, TI vice president, OMAP Platform general manager, Wireless Terminal Business Unit "The high-performance and the low power consumption of the complete system solutions will also enable application developers to fully exploit the possibilities offered by 2.5 and 3G services." TI delivers the building blocks wireless manufacturers need to bring high-performance, power-efficient products to market - including complete wireless terminal chipsets and reference designs with protocol stacks and OMAP (TM) application processors. The OMAP platform is comprised of high performance, power-efficient processors a robust software infrastructure and comprehensive support network for the rapid development of differentiated 2.5G and 3G multimedia-enhanced mobile devices and software applications. TI's OMAP processors provide full compatibility with Series 60 Platform and Symbian OS(TM), allowing developers to create advanced applications in a proven environment. The TI Innovator Development Kit for the Series 60 Platform enables application developers and handset manufacturers to simulate and validate their applications in a close-to-final mobile terminal environment. The development kit is an ideal tool for building on and demonstrating high-performance applications and smart phones on a battery-operated handheld. The Series 60 Platform is a software product for smart phones that Nokia licenses to other mobile-handset manufacturers. Manufacturers will be able to integrate the Series 60 into their own phone designs running on top of Symbian OS. The Series 60 Platform includes mobile browsing, multimedia messaging and content downloading, as well as a host of personal information management and telephony applications. In addition, it includes a complete and modifiable user interface - all designed to run on top of Symbian OS, an operating system for advanced, data enabled mobile phones. In a related announcement, Nokia launched the Series 60 Product Creation Community designed to accelerate the development and acceptance of standards-based smart phones. Through the agreement TI becomes the first semiconductor member of the community. + Post comment/question/reply
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